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America Future Secrets Military Weapons #Mind Blow (Full Documentary)

MOST FEARED Weapons Technology for US Military (Message to world) 2016.

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Silicon forms the basis of everything from solar cells to the integrated circuits at the heart of our modern electronic gadgets. However the laser, one of the most ubiquitous of all electronic devices today, has long been one component unable to be successfully replicated in this material. Now researchers have found a way to create microscopically-small lasers directly from silicon, unlocking the possibilities of direct integration of photonics on silicon and taking a significant step towards light-based computers.

Whilst there has been a range of microminiature lasers incorporated directly into silicon over the years, including melding germanium-tin lasers with a silicon substrate and using gallium-arsenide (GaAs) to grow laser nanowires, these methods have involved compromise. With the new method, though, an international team of researchers has integrated sub-wavelength cavities, the basic components of their minuscule lasers, directly onto the silicon itself.

To help achieve this, a team of collaborating scientists from Hong Kong University of Science and Technology, the University of California, Santa Barbara, Sandia National Laboratories and Harvard University, first had to find a way to refine silicon crystal lattices so that their inherent defects were reduced significantly enough to match the smooth properties found in GaAs substrate lasers. They did this by etching nano-patterns directly onto the silicon to confine the defects and ensure the necessary quantum confinement of electrons within quantum dots grown on this template.

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Gene-based circuits are about to get decidedly more sophisticated. MIT scientists have developed a method for integrating both analog and digital computing into those circuits, turning living cells into complex computers. The centerpiece is a threshold sensor whose gene expression flips DNA, converting analog chemical data into binary output — basically, complex data can trigger simple responses that match the language of regular computers.

The practical applications are huge. Along with general-purpose computing, you could have advanced sensors that trigger different kinds of chemical production depending on levels for other chemicals. You could produce insulin when there’s too much glucose, for instance, or deliver different kinds of cancer therapy. And this isn’t just talk. Clinical trials for a simple gene circuit (which will treat gut diseases) are starting within a year, so you could see these organic machines in action before too long.

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If you’ve ever held a high-quality camera lens, the first thing you notice is the weight. Thanks to layers and layers of thick glass hunks inside, they end up being very heavy. However, thanks to research being done at Harvard on something called metalenses, one day those mgiant glass-filled lenses might be obsolete.

The curved surfaces on a glass lens focus incoming light onto a camera’s digital sensor. The more precise (and expensive) the lens is, the better the image it will produce.

Metalenses work in a similar way, but they’re not made of precision-ground glass. Instead, a layer of transparent quartz is completely covered in a layer of tiny towers made from titanium dioxide. When arranged in specific patterns, those complex tower arrays can focus light exactly like a glass lens does. Except that these tiny metalenses end up being thinner than a human hair, and weigh almost nothing.

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More energy efficient, high performance microprocessors on the way.


Abstract: Tiny high-performance lasers grown directly on silicon wafers solve a decades-old semiconductor industry challenge that, until now, has held back the integration of photonics with electronics on the silicon platform,

A group of scientists from Hong Kong University of Science and Technology; the University of California, Santa Barbara; Sandia National Laboratories and Harvard University were able to fabricate tiny lasers directly on silicon — a huge breakthrough for the semiconductor industry and well beyond.

For more than 30 years, the crystal lattice of silicon and of typical laser materials could not match up, making it impossible to integrate the two materials — until now.

As the computation and communication circuits we build radically miniaturize (i.e. become so low power that 1 picoJoule is sufficient to bang out a bit of information over a wireless transceiver; become so small that 500 square microns of thinned CMOS can hold a reasonable sensor front-end and digital engine), the barrier to introducing these types of interfaces into organisms will get pretty low. Put another way, the rapid pace of computation and communication miniaturization is swiftly blurring the line between the technological base that created us and the technological based we’ve created. Michel Maharbiz, University of California, Berkeley, is giving an overview (june 16, 2016) of recent work in his lab that touches on this concern. Most of the talk will cover their ongoing exploration of the remote control of insects in free flight via implantable radio-equipped miniature neural stimulating systems.; recent results with neural interfaces and extreme miniaturization directions will be discussed. If time permits, he will show recent results building extremely small neural interfaces they call “neural dust,” work done in collaboration with the Carmena, Alon and Rabaey labs.

Radical miniaturization has created the ability to introduce a synthetic neural interface into a complex, multicellular organism, as exemplified by the creation of a “cyborg insect.”

“The rapid pace of computation and communication miniaturization is swiftly blurring the line between technological base we’ve created and the technological base that created us,” explained Dr. Maharbiz. “These combined trends of extreme miniaturization and advanced neural interfaces have enabled us to explore the remote control of insects in free flight via implantable radio-equipped miniature neural stimulating systems.”

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When I 1st read this headline, I had to pause and ask myself “was the article’s author informed at all on QC?” especially given China’s own efforts much less D-Wave, Google, and University of Sydney. And, then I read the article and I still have to wonder if the author is on top of the emerging technologies such as BMI, graphene, QC, and other nanotechnology that are already being tested to go live in the next 7 to 10 years plus much of the content is very superficial at best. I am glad that the author did put the tid bit on Singularity as the endpoint state; however, that is pretty well known. Nonetheles, sharing to let you be the judge.


For decades, we relied on silicon as the semiconductor for our computer chips. But now, working at nanometer scales, it looks like physical limitations may end the current methods to include more and more processing power onto each individual chip.

Many companies are making billion-dollar investments to continue scaling down semiconductor technology. The pressures of big data and cloud computing are pushing the limits of the current semiconductor technology in terms of bandwidth, memory, processing speed, and device power consumption.

Today’s state-of-the-art silicon chips are engineered at the 22- and 14-nanometer scale. Research is underway to take that down to 10-nanometer scale in the next several years.

Storage in your laptop or smartphone is a compromise between volume, access speed and physical size. But, the industry’s competition to shrink them while boosting their specifications is fierce. A few months after shipping a 16TB solid-state drive, Samsung has announced a fast, efficient 512GB SSD that’s half the size of a postage stamp.

Samsung’s press release claims that the drive is the first mass-produced 512GB SSD with non-volatile memory express (NVMe), a host-controller interface with a streamlined register for speed, in a single package. Unlike other hard drives in multi-chip packages (MCP), Samsung’s new drive is organized in a ball grid array into a collected unit, making it simpler to fit in and connect to other parts in the device. This makes the drive ideal for the ultra-slim notebook PC market, where space and weight are at a premium.

A senior Samsung VP said in a press release that the tiny drive triples the performance of a typical SATA SSD. Its read/write speeds of up to 1,500MB/s and 900MB/s, respectively, mean you could transfer a 5GB HD video in 3 seconds. Samsung will start selling the drive in June in 512GB, 256GB and 128GB models.

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