Intel is matching foundry rival, TSMC, node-for-node with its new process naming convention, but has also fired the first shot in the race for sub-nanometer terminology. Below 1nm, we’re moving into what it’s now calling the ‘angstrom era of semiconductors’.
At the Intel Accelerated event CEO, Pat Gelsinger, has unveiled a detailed process roadmap for its future nodes, all tied into a new way to reference them. “We are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” he says.
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